LMV393M changing in used wafer / die
Dear TI-Team, we have a problem with the behavior of LMV 393M in different batches.
The devices with Top Marking M8AB work properly.
The devices with Top Marking MMAB do not work like the other ones.
We know, in batch M8AB is used a "big" die inside with the layout of an quad structure. Only 2 of the 4 devices are used . The die has a design date of 2002. This die works in our design.
In batch MMAB is used a smaller die with the layout of an double structure. All pins are used. This die has a design date of 2006. We think there are additional protection diodes on the inputs.
1. Please tell us, when was die changed?
2. Until which date code / Top Marking was the older die used?
3. Which top Markings use the old design ?
4. Was there a PCN of the die change and wherw can we find this?
5. Can we buy chips with the 2002 die ?
6. Pleas send us a conversion Table between Top-Marking and production date.
Thank you very much for your support !
Jens Grimmer
jens.grimmer@draeger.com