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reflow soldering

mark kovach
Intellectual 300 points
Other Parts Discussed in Thread: TLE2071, THS3061, OPA1611, INA163

Can plastic package op amps be IR re-flow soldered?  If so, does TI publish a safe re-flow curve?  I've seen many papers in the TI library on methods, techniques, tools etc., but can not find a recommended safe curve, assuming that it's the same for all P-DIP and P-SOIC packages.  Even a chart on the maximum time vs. temperature exposure would be helpful.  

  • 0
    TI__Genius 13935 points

    Do you have a particular part in mind?  I've included a link that covers some of our parts.  

    http://www.ti.com/general/docs/lit/getliterature.tsp?baseLiteratureNumber=SNOA549

     

     

  • 0 in reply to Loren Siebert 1
    Intellectual 300 points

    Hi Loren

    I'm a little confused by the chart as it seems that as the package gets thicker and larger by volume it's ability to withstand prolonged heat diminishes.  To me this is counter intuitive.  We use many TI and BB parts in our designs and we also prototype and redesign with many others.  Here is a partial list of the most popular:

    TLE2071

    THS3061 3091

     OPA1611 627 827 211 1641 134

    INA163 134

    LME49710 49713, 49870

    In some above we also use their dual versions.

    All above are SOIC 8 (except INA163 SO-14) for the most part, some are DIP 8 but we can continue hand soldering those.

    We use either the lead or lead free (whichever is available through distributors.)

    The solder requires a maximum tempereature of 246C for only 4 seconds,  but is above 240C for a total of 12 seconds.

    It would be convenient if TI had a chart that, at the very least, listed all packages by their thickness and volume, and desirable if the white papers listed the the max temperature and time for each device.  The best would be a graph of maximum temp and time as Vishay shows for their Z-foil resistors.