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XTR106U device marking

Jayant Deshpande
Expert 1495 points

Hi,

Facing problems with XTR106U in six ICs out of a batch of ten. No VRef5, output current iz zero. Other parts work as desired. All parts marked with Burr Brown logo.

Could this be a spurious parts issue? Do the parts come with TI logo or BB logo?

Thanks,

JayantD

 

  • 0
    TI__Guru 62915 points

    Hi Jayant,

    I took a look at some XTR106U devices that I have and they do indeed have the "BB" logo.  If you provide a clear and readable image of the topside marking of the chip we can look it up to verify it's a valid date and product code.

    Any possibility of a handling issue that may have caused ESD issues?

  • 0 in reply to Collin Wells
    Expert 1495 points

    Hi Collin,

    This is about the best I could manage.. it says "BB 14CRR2K XTR106U". I will probe further about ESD setup at the assembler's.

    Thanks,

    Jayant

  • 0 in reply to Jayant Deshpande
    Expert 1495 points

    One more, from the same lot..

    Thanks,

    Jayant

  • 0 in reply to Jayant Deshpande
    TI__Guru 62915 points

    Hi Jayant,

    Both products you've shown feature legitimate product markings and lot code numbers.  Are you receiving any failing products with different lot codes or do all of the failing units have the same code?  

    Have you found any updates from your assembler regarding possible assembly issues that could be damaging these devices?  If not, we could initiate a failure analysis investigation to try to find the issue.

  • 0 in reply to Collin Wells
    Expert 1495 points

    Hi Collin,

    All the failing units have the same lot code.

    At the assembly facility, which is outsourced, proper care is being taken, but the sensor is being soldered to the PCBs at a different location. In this particular case the sensors have been soldered without any anti-static precautions. Most likely this is the reason for the unexpected failures.

    I will get another pilot batch assembled with all due precautions.

    What is the procedure in case a failure analysis investigation is to be done?

    Thanks,

    Jayant

     

  • 0 in reply to Jayant Deshpande
    TI__Guru 62915 points

    Hi Jayant,

    Sounds like it's probably a handling issue at the sensor assembler as you've suggested.  If the next batch of units has the same issues I'll have you ship me a few of them to perform FA on.