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DRV103 Power-Pad tie to ground plane or isolate?

Shawn Johnston
Prodigy 40 points
Other Parts Discussed in Thread: DRV103

Regarding the DRV103 solenoid driver in the power-pad package...

The datasheet says do not use this pad as a ground, but the footprint shows vias on the pad.  Is the intent of the vias to tie to a backside isolated copper island for more heat spread... or should be pad actually be via'd to a ground plane?

Thanks.

  • 0
    TI__Genius 9975 points
    Hello Shawn Johnston,

    From the DRV103 datasheet: "Figure 12 provides recommended PCB layouts for both the SO-8 (U) and the PowerPAD™ SO-8 (H) packages. Although the metal pad of the PowerPAD™ SO-8 (H) package is electrically connected to ground (pin 4), no current should
    flow in this pad. Do NOT use the exposed metal pad as a power ground connection or erratic operation will result. For
    lowest overall thermal resistance, it is best to solder the PowerPAD™ directly to a circuit board, as illustrated in
    Figure 13. Increasing the “heat sink” copper area improves heat dissipation. Figure 14 shows typical junction-to-ambient
    thermal resistance as a function of the PC board copper area."

    The intent of the vias to tie to a backside isolated copper island for more heat spread.

    Hope this helps.

    Best regards,

    Jose