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OPA452 - Thermal Resistance

Ryuji
Guru 20090 points
Other Parts Discussed in Thread: OPA452

Hello,

Regarding figure 4 on the OPA452 datasheet, I think that this data was measured on the JEDEC specification test board.
Is this circuit board 2s2p board?  Or is this 1s board?


Best Regards,
Ryuji Asaka

  • 0
    Guru 20090 points
    Hello,

    I'm looking forward to your reply.

    Best Regards,
    Ryuji Asaka
  • 0 in reply to Ryuji
    TI__Guru* 93105 points

    Asaka-san,

    I will investigate your OPA452FA thermal question. This may takes a few days for me to find the answer. I will report here when I have it.

    Regards, Thomas

    PA - Linear Applications Engineering

  • 0 in reply to Thomas Kuehl
    Guru 20090 points
    Hello Thomas san,

    Thank you for the reply.
    I'm looking forward to your investigation.

    Best Regards,
    Ryuji Asaka
  • 0 in reply to Ryuji
    TI__Guru* 93105 points

    Hello Asaka-san,

    I searched the information in our OPA452 archive regarding the about the basis for the Figure 4 graph. Nothing specific about it was found; however, I did get a lead to someone who was involved with the power amplifier thermal work about 15 years ago and he is still with TI. 

    I explained to him that we were attempting to determine if Figure 4 for was based on the JEDEC 1s (low-k), or 2s2p (high-k) test board. He said it wasn't exactly either one. It turns out that the the test was conducted using a double-sided, 0.062" board, with 1-oz copper on each side. The circuit board copper areas as shown in Figure 4 were etched so that had equal copper area on each side of the board. There were no vias used between the two copper planes. 

    Although the Figure 4 board isn't exactly equivalent to the 2p2s test board, it is closest to that board configuration. 

    Regards, Thomas

    PA - Linear Applications Engineering