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THS4521 package dimension question

BX27
Genius 3900 points

Hi there

On Datasheet page 58, DGK package, Note E : Falls within JEDEC MO-187 variation AA, except interlead flash. 

What dimension does interlead flash refer to?

Thanks!

  • 0
    TI__Genius 13935 points

    Hello Yi,

    Mold flashing is extraneous material that accidentally escapes the mold during the injection and curing process.  In this case the flashing would occur in between the land pads on the package.  I believe this is just a generic disclaimer because I have never seen or heard any reports of mold flashing on this device. 


    I will ask our product engineer why we have this disclaimer.

    Regards,

    Loren

  • 0 in reply to Loren Siebert 1
    Genius 3900 points
    Hello Loren,
    Thanks. I am not familiar with the semiconductor manufacturing process. but it will be OK as long as this package dimension is compliant with JEDEC MO-187 variation AA, so we could build the correct PCB footprint.