LMP7717MFX/NOPB, LMV796MFX/NOPB; I need some specification for the mentioned Op-Amps

Hello Rajadurai,

The soldering information is on the web under the quality and packaging section:

www.ti.com/.../quality
www.ti.com/.../quality

The reflow cycle is not something we can specify. That will depend on the solder and flux that you use as well as the thermal characteristics of your PCB.

I don't know how to answer your tape and reel question. I do see that our datasheet does not give this dimension. Perhapes there is an industry standard that specifies this somewhere. I can look to see if I can find one.

Regards,
Loren

Hello Rajadurai,

The specification for tape and reel sprocket to pocket center spacing is covered in EIA 481. For 12mm tape it is 5.5 +- 0.05mm. For 8mm tape it is 3.50 +- 0.10mm.




Regards,
Loren

Hello loren ,
Thank you for helping me. I went through the details before itself, i also have one Pdf for soldering specifications by TI. I am not able to get one particular data, which is the solder time above liquidous temperature.

Hello Rajadurai,


" I am not able to get one particular data, which is the solder time above liquidous temperature."

I am not sure we can speicfy this. Different solder chemistry has different liquidus temperature. Our parts will conform to the appropriate JEDEC standards. If you use a standard JEDEC soldering profile (peak 260 C or less) then you should be fine.




Regards,
Loren