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ISO124: Layout Query

Part Number: ISO124


Hi,

I am designing a 6 layer PCB with ISO124U.

Now layout guideline explains as follows:- the entire area underneath the device should be kept free of any conducting materials.

My top layer is signal layer. Second layer is GND. Do in need to have a keep-out area where no ground pour is there just on layer 2 or all the 6 layers beneath the IC.

A quick revert will be very helpful.

Regards

  • Hi ARM,

    If you intend to have some sort of safety isolation with the ISO124, you would need to keep the entire stack of your PCB clear under the chip. If you are not concerned about meeting any minimum safety spacing requirements, then there would be no concern.