Hi,
I am designing a 6 layer PCB with ISO124U.
Now layout guideline explains as follows:- the entire area underneath the device should be kept free of any conducting materials.
My top layer is signal layer. Second layer is GND. Do in need to have a keep-out area where no ground pour is there just on layer 2 or all the 6 layers beneath the IC.
A quick revert will be very helpful.
Regards