OPA564: DWP Package Specifications

GIE Design

Part Number: OPA564

Hello,

The datasheet for this part on page 24 under Bottom-Side PowerPAD Assembly Process in items 2 and 3 indicate there is an "attached thermal land pattern mechanical drawing" that shows the top side etch pattern and recommended number of thermal vias. The only information close to this is page 33 in the PDF, "DWP mechanical data". This page shows the physical outline for the part and thermal pad, but gives no recommended top side etch pattern, number, or location of thermal vias. I contacted support@ti.com and they provided the document ‘PowerPad Made Easy’, and I also downloaded the Ultra Librarian .bxl files associated with this part. The patterns provided in the two documents differ substantially, including number and location of vias, thermal land size/spacing from pins, pin pad dimensions, as well as others.

Could you provide guidance as to the recommended layout for this part as well as the discrepancy between the documents?

Thanks!

Zeke Gustafson

over 8 years ago

0 Thomas Kuehl over 8 years ago

TI__Guru* 93105 points

Hello Zeke,

Since this is outside the usual area of electrical applications issues which we handle directly, I am having to contact our analog packaging team about it. I just finished sending an email requesting asisstance. Since we are in different time zones I suspect the earliest I may receive a reply would be tomorrow.

I'll let you know what I find regarding the recommended OPA564 PC board PowerPAD footprint.

Regards, Thomas

Precision Amplifiers Applications Engineering

0 GIE Design over 8 years ago in reply to Thomas Kuehl

Prodigy 80 points

Hi Thomas,

Thanks for the assistance; I look forward to your response!

Zeke

0 Thomas Kuehl over 8 years ago in reply to GIE Design

TI__Guru* 93105 points

Hi Zeke,

I have submitted a request to the responsible TI group, to have a new, up-to-date PC board pattern for the OPA564 DWP created. This pattern will be based on the latest information and should result in the most thermally effective layout. It will take a little time for it to be created, but I have asked for a completion within one week.

Hopefully it will be done sooner.

Regards, Thomas

Precision Amplifiers Applications Engineering

0 Oliver Landine - WEBENCH® Design Center over 8 years ago

TI__Expert 3055 points

Hi Zeke,

Thanks for contacting TI. I'm not in the packaging group, but I do work closely with them. I wanted to confirm to you that Thomas is on the right track to get improved information into the datasheet.

In case the new drawing takes longer than expected, I wanted to give you some advance information of what to expect. I'm attaching a PDF drawing for a very similar package and leadframe. Your footprint should basically match this, just with adjustments on the mask layers to match the maximum opening for the thermal pad (3.81 x 4.32 mm).

We'll work to update the footprint in the .bxl file for this part.

I hope this helps you get going quickly.

Regards,

Oliver

DWP0020B.pdf

0 GIE Design over 8 years ago in reply to Oliver Landine - WEBENCH® Design Center

Prodigy 80 points

Hi Oliver and Thomas,

I appreciate the work you guys and the packaging team are doing. I'll see what I can get done with that document to at least get started, but I'll probably need some more information before I can get the board finalized.

Thanks!

Zeke

0 GIE Design over 8 years ago in reply to Oliver Landine - WEBENCH® Design Center

Prodigy 80 points

Do you have an update or ETA on when this will be done? I've need to send the prototypes off within the next week and need to have some more details if at all possible. Thank you so much for your work on this already!

0 Thomas Kuehl over 8 years ago in reply to GIE Design

TI__Guru* 93105 points

Hi Zeke,

I checked the status in the electronic system and it shows that it is still in the queue. I just have sent an email to the orgainzation that does the work requesting an estimate of the completion date. As soon as I get a reponse I'll let you know what it indicates.

Regards, Thomas

Precision Amplifiers Applications Engineering

0 GIE Design over 8 years ago in reply to Thomas Kuehl

Prodigy 80 points

Thanks Thomas!

0 Thomas Kuehl over 8 years ago in reply to Thomas Kuehl

TI__Guru* 93105 points

Hello Zeke,

I just received notification that the OPA564 DWP is assigned and should be started very soon. I've just sent an email requesting an estimate of the completion date. I'll let you know what I find.

Regards, Thomas

Precision Amplifiers Applications Engineering

0 Thomas Kuehl over 8 years ago in reply to GIE Design

TI__Guru* 93105 points

Hello Zeke,

The new land pattern CAD work for the OPA564DWP has been completed and is now going through the review and sign off processes. As soon as those steps are complete the new pattern information should become available.

Regards, Thomas

Precision Amplifiers Applications Engineering

0 GIE Design over 8 years ago in reply to Thomas Kuehl

Prodigy 80 points

Sounds great, thanks!

0 GIE Design over 8 years ago in reply to Thomas Kuehl

Prodigy 80 points

Where will I be able to find the patterns when they are complete?

0 Thomas Kuehl over 8 years ago in reply to GIE Design

TI__Guru* 93105 points

Hi Zeke,

Earlier this morning I sent an email to the CAD team asking if there was a way to get the new OPA564DWP land layout while the sign-off, and system updates were being completed. Since I just sent that message a couple of hours ago I haven't heard anything back yet. I'd like to give the team a chance to repond before I ping them again. I'll try and give you an update as soon as I can.

Regards, Thomas

Precision Amplifiers Applications Engineering

0 GIE Design over 8 years ago in reply to Thomas Kuehl

Prodigy 80 points

Sounds great, I appreciate your (and their) work on this!

0 Thomas Kuehl over 8 years ago in reply to GIE Design

TI__Guru* 93105 points

Hi Zeke,

Please send an email to my TI email address listed bleow and I'll send you a pre-release document showing the nelwy revised OPA564DWP PCB land information. This information will be posted to the web page once the sign-offs and upload are completed.

kuehl_tom@ti.com

Regards, Thomas

Precision Amplifiers Applications Engineering

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OPA564: DWP Package Specifications