Hi Team,
My customer is using OPA564AIDWP and found thermal issue. When this part is under operation the case temperature is around 90degC, RD would like to know is it helpful if he adds a heat sink(since the thermal pad is under device)? Is there thermal resistance data of DWP package with a heat sink? There is a application note, SLMA002G, that describe the relationship between θJC and via number in figure9, can RD refer to this plot to get θJC value if he follows the thermal via patterns?
Thanks very much.
Best Regards,
Vincent Chen