We are using the OPA277 and the OPA4277, both within the DFN-8 package and we are experiencing some overheating. We mistakenly connected the thermal pad to the main ground plane of the board rather than to V- (-9V with respect to the main ground plane) as required by the datasheets. Could that be the source of the overheating we are experiencing? We performed a few tests on the chips themselves and the Thermal pads appear to be floating regardless of the pin we are referencing. Anybody knows how the thermal pads are connected within the amplifiers? Thanks.
