TLV9062: TLV9062 : Exposed pad and GND connection

Sunset

Part Number: TLV9062

Hello team,

the TLV9062 datasheet specifies that the exposed thermal pad (WSON package) must be connected for mechanical and thermal performance.

Nevertheless it is not specified if this exposed pad is connected or not to GND.

Many devices have this pin connected to ground but I cannot take it out of the TLV9062 datasheet.

Can you confirm if the thermal pad is connected to GND or not?
If not, connecting it to GND is it a problem?

My recommendation would be to have this info in the datasheet, it may help farther designer.

Thanks,

SunSet

over 7 years ago

0 Ron Michallick over 7 years ago

TI__Guru**** 165146 points

SunSet,

There is no direct wire bonding to the thermal pad. However the there may or may not be a resistive path from the pad to the bottom and sides of the silicon die due to the conductive adhesive compound. The bottom and sides are GND potential. The pad can be connected to device's GND pin or it may be left unconnected.

0 Sunset over 7 years ago in reply to Ron Michallick

TI__Genius 13995 points

Thanks for your feedback.

SunSet

Amplifiers

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TLV9062: TLV9062 : Exposed pad and GND connection