TLE2072: Question regarding Thermal resistance from junction to board

Hi Sam,

Which package are you interested in? I see the following for Junction to Case in the datasheet under absolute maximum ratings:

Package thermal impedance, θJC (see Notes 4 and 5):
FK package 5.6 . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W
J package 15.1 . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W
JG package 14.5 . . . . . . . . . . . . . . . . . . . . . . . . . °C/W
U package 14.7 . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W
W package 10 . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W

Best,
Paul

The complete part number is TLE2072IDR

Thanks Sam. I'll take a look and see what I can find for the quantities you've asked for. I'll let you know if we need to submit a request to the thermal team to get this information.

Thanks,
Paul

Excellent, thank you Paul,
Sam

Hi Sam,

We're submitting a request to our thermal modeling team. I'll post back with the information you're looking for once I have it. It may be as long as about 5 business days, but usually it's a little quicker than that.

Thanks,
Paul

Thank you for keeping me posted!
regards,
Sam