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THS4021 power dissipation

Fausto Bartra
Prodigy 160 points

1.- To calculate the "short circuit" (RL = 10R) power dissipation for this device:

Pd = Ibias*Vcc + Iload*(Vcc-Voutput), is this assumption correct? (approx..)

2.- Which pin(s) of this device can be used to sink heat this device (D package)?

I am trying to use the PCB as heat sink. (I can't use the DGN package because of foot size compatibility)

3.- The DGN package has a thermal pad, where is it connected internally?
can I connect it to GND?

Thank you

Fausto

 


  • 0
    TI__Genius 17905 points

    Fausto,

    1) Yes, that equation is a good approximation of the power dissipated in the device.

    2)  In the D package, the pins will not be effective in transferring heat away from the device as the pins are just connected by bondwire to the die and there is no die-pad thermal connection as in the PowerPAD package.

    3) In the DGN PowerPAD package, the thermal pad is electrically isolated from all the terminals and you can connect it to GND. GND is recommended because it is often a large and continuous plane ideal for sinking the heat.