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TLV9061: Footprint issue

Ariel Pickholz26
Intellectual 1295 points
Part Number: TLV9061

Hi Team ,

 

My customer's questions is as follows :

 

According to data sheet of the TLC9061 the Layout recommendation is as follows :

In boards with PCB thickness of 4mm we cannot use a 4mil via due to aspect ratio –

Please suggest us an alternate Layout footprint .

 

Best regards ,

 

Arik.P.

AFAE

  • 0
    TI__Mastermind 30600 points
    Hi Arik,

    This package is tough one, there are a couple options.

    You can route between the pins but that will require a very small trace (~2mil). You can also make the hole a little bigger but there is a very real concern about solder wicking into the hole on assembly.

    To mitigate the wicking, the best option would be to ask the PCB manufacturer if they have the capability to fill the hole once it is drilled and then have the hole plated over so that it functions like a regular pad. This can usually be done with epoxy or metal.

    We have an app note on layout with this package that can be useful: www.ti.com/.../scea055.pdf

    Let me know if you have further questions.

    -Paul