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OPA855: OPA855 EFFECT OF PINS UNDER IC PACKAGE

Part Number: OPA855


The  OPA855 is in a lead-less  package. Some PC board assembly houses recommend the mating footprint on the PCB extend the pin traces outside the periphery of the IC package for lead-less packages. At frequencies near 1GHz has anyone had any experience with this issue. How far can the pin be extended outside the package outline with no issues at lets say up to 1GHz?