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OPA1612: SON Thermal Characteristics

Don Schelle
Expert 4150 points
Part Number: OPA1612

Hello,

I'm looking for thermal parameters for the OPA1612.   Specifically ThetaJA and ThetaJB are the parameters i'm after, but a complete table would be nice.   The target package is SON (DRG).

Many thanks in advance for a speedy response.

Don

  • 0
    TI__Expert 7540 points

    Hi Donald,

    While we don't have the specifications listed for the OPA1612, the OPA2211 datasheet specifies the following: 

    RθJA Junction-to-ambient thermal resistance, high-K board  125 °C/W

    RθJB Junction-to-board thermal resistance 28.8 °C/W

    RθJC(bot) Junction-to-case (bottom) thermal resistance 19.1 °C/W

  • 0 in reply to Alex Davis
    TI__Expert 4150 points

    Thanks Alex,

    Since the OPA1612 shares the same package as the OPA2211, would it be safe to assume that the thermal characteristics are also the same?   Is there any deviation regarding package construction of the two devices (other than the piece of silicon inside)?

    Don

  • 0 in reply to Don Schelle
    TI__Expert 7540 points
    Hi Donald,
    It's safe to assume that the thermal characteristics of the two would be very similar.