OPA1612: SON Thermal Characteristics

Don Schelle

Part Number: OPA1612

Hello,

I'm looking for thermal parameters for the OPA1612. Specifically ThetaJA and ThetaJB are the parameters i'm after, but a complete table would be nice. The target package is SON (DRG).

Many thanks in advance for a speedy response.

Don

over 7 years ago

0 Alex Davis over 7 years ago

TI__Mastermind 19560 points

Hi Donald,

While we don't have the specifications listed for the OPA1612, the OPA2211 datasheet specifies the following:

RθJA Junction-to-ambient thermal resistance, high-K board 125 °C/W

RθJB Junction-to-board thermal resistance 28.8 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance 19.1 °C/W

0 Don Schelle over 7 years ago in reply to Alex Davis

TI__Expert 4150 points

Thanks Alex,

Since the OPA1612 shares the same package as the OPA2211, would it be safe to assume that the thermal characteristics are also the same? Is there any deviation regarding package construction of the two devices (other than the piece of silicon inside)?

Don

0 Alex Davis over 7 years ago in reply to Don Schelle

TI__Mastermind 19560 points

Hi Donald,
It's safe to assume that the thermal characteristics of the two would be very similar.

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OPA1612: SON Thermal Characteristics