Friends
I am posting this question on behalf of a customer:
"We have been using the raw die version of the PGA309 successfully up to this point. However, we have an application which requires a lid to be soldered over the cavity that holds the PGA. Some failures were traced back to the PGA where we noticed a drop of flux splattered on top of the PGA die. Cleaning the surface of the PGA with acetone tended to restore performance. We'll eventually locate a more appropriate sealing method but we're stuck with the use of flux to solder the lid for the time being. Our quick fix was to glob top the PGA prior to sealing using Hysol H70E-2 (dielectric constant 5.19). Our first attempt resulted in 15 pieces out of 41 having either high current or we couldn't communicate with the PGA. Questions: Is glob topping the PGA not a good idea? Does the PGA have a passivation layer? Thick? Suggestions?" Normal 0 false false false EN-US X-NONE X-NONE MicrosoftInternetExplorer4
Please let me know if you have any thoughts on how to solve this issue.
Regards,
~ee