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OPA855: OPA855 package SOIC08

Part Number: OPA855

Hi,

Is it possible to get an OPA855 with the SOCI08 package or any other package instead of WSON to be easieable to solder it.

Thank you.

  • Hello Bob,

    Unfortunately, the OPA855 is only available in the WSON package. This is to ensure the stability of the part by attempting to reduce the parasitics in its use. This app note may help in your design:

    www.ti.com/.../slua271b.pdf

    Best,
    Hasan Babiker
  • Hello and welcome to E2E,

    E2e is more designed to help answer any technical questions customers might have related to designing with or using our parts.

    We only provide our parts in the available packages listed in the packaging information addendum of the datasheet. For this part it does seem like OPA855 comes only in the WSON package. The only way that we would be able to start packaging a part differently would be if there was a significant business need.

    www.ti.com/.../
    You can email customer support to learn more about this or if you believe there is a significant business need for this.

    Thanks!
    -Karan
  • Thank you for your reply.

    Can you tell me how do you solder an OPA855 ?

  • Hello Bob,

    Reflow soldering is meant to be used to attach the OPA855 to your PCB. The app note I attached earlier goes into detail on the PCB design process and reflow soldering process to help you in implementing the OPA855 in your design.

    Best,
    Hasan Babiker
  • Hi Bob,

    it's really hard to handle a decompensated 8GHz GBP OPAmp! That's a totally different story than to work with a normal HF OPAmp. Even sub millimeter signal lengths play a role. Because of this it would be really hard (read impossible) to make a OPA855 circuit work, if the OPA855 would come in a SO8 package.

    A WSON package should be mounted with machine soldering. For prototyping I use hot-air soldering in combination with pre-heating. See also here:

    https://e2e.ti.com/support/amplifiers/f/14/p/701057/2618501#2618501

    Kai