• State TI Thinks Resolved
  • Locked Locked
  • Replies 2 replies
  • Answers 1 answer
  • Subscribers 47 subscribers
  • Views 309 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

INA226-Q1: Does this part use a flipped-chip die?

Rachael Huffman
Prodigy 30 points
Part Number: INA226-Q1

Does this component use a flip-chip package?  Is there any SEE data available for this part? 

  • 0
    TI__Mastermind 26335 points
    Hello Rachael,

    Thanks for considering to use Texas Instruments. The INA226-q1 is available in a wire-bonded DGS package. Were you interested in knowing if it is available in a flip-chip package for the sake of reducing the size or do you have another motivation for using a flip-chip package? As for SEE data, I presume you are talking about Single Event Effect data? If so, are you trying to find something for a space application?
  • 0 in reply to Patrick Simmons
    TI__Mastermind 26335 points
    Hello Rachael,

    As I have not heard from you in a while, I presume you have found the information you need or are moving on to a different part. As such I will close this thread. However, if you do need further support, please reply below to reopen the thread.