LM2901: Ball composition

Hello Yusuke-san,

You can view the material content of any device from this page:

 http://www.ti.com/materialcontent/home

Be sure to click on the "TI Part Number" list for your device to get the second page with the full contents.

Here are the results for the LM2901

 http://www.ti.com/materialcontent/en/report?pcid=24406&opn=LM2901PW

The plating thickness is not as easy, as the thickness varies depending on package materials used - which varies device to device. We have to look that up internally.

The leadframe is copper with a NiPdAu plating. The NiPdAu plating thickness is 0.5um min, 2.02um max.

Please see the Packaging Information page for recommended soldering, particualrly in the "General packaging information" section.

http://www.ti.com/support-packaging/packaging-resources/SMT-and-application-notes.html

I'm not sure of question #1. Can you please elaborate?

#2 - are you asking if the parts are annealed? Or if they need further annealing by the customer?

Dear Paul san

Thank you for your comment.
Sorry, I made a mistake about the used material

Our customer ask us the following question to register the device in which Sn(not Ni) is used.

Looking at following website, I can find the information on using material of lead and ball finish.
LM2901PWR have Cu and NiPdAu or Cu and Sn, right?
www.ti.com/.../pinout-quality

In case of use Sn, I have some question that I asked you.

1. Use Ni for grounding or not. : Yes / No
　> This device use Ni for under coat ：Yes/No

2. Thickness of outermost layer plating :　10 μm or more / Less than 10 μm

3. Heat treatment such as annealing or not : Yes / No
　⇒I ask you if parts are annealed.

If you have any inquiry, please kindly contact us, thank you.

Hello Yusuke-san,

1. This device use Ni for under coat ：Yes

2. Thickness of outermost layer plating :　 Less than 10 μm (2.02um max)
Ni = 0.5um min
Pd = 0.01um min
Au = 0.003um min

3. Heat treatment such as annealing or not : Checking

I assume the questions about Ni and annealing is about tin whiskers?

Dear Paul san

Thank you for update.

>2. Thickness of outermost layer plating :　 Less than 10 μm (2.02um max)
>Ni = 0.5um min
>Pd = 0.01um min
>Au = 0.003um min

How about in case of Sn?

>3. Heat treatment such as annealing or not : Checking

Could you kindly support by 6ht-Apr?

>I assume the questions about Ni and annealing is about tin whiskers?

Maybe, Yes.

Hello Yusuke-san,

No. NiPdAu is not annealed.

For Sn plating, it is annealed:

To mitigate whisker growth Texas Instruments has done the following:
– Established the minimum plating thickness of 8 microns, with a nominal thickness of 12 microns.
– Established a post-plate annealing of 1 hour at 150°C within 24 hours of plating.

Dear Paul san,

Thank you for confirming.

I have the last question to you.

Thickness of Sn, outermost layer plating :　10 μm or more / Less than 10 μm

Thank you & Best Regards,

Hello Yusuke-san,

Nominal is 12μm, minimum is 8μm - so it depends on if you want to use the nominal or minimum.