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Hi TI community,
sorry to bother you with a most probably stupid question ...
For my actual design I am planning to use the amplifier THS7002. But I get confused about the connection of the thermal pad. The PowerPad design considerations recommend the connection to the "internal ground plane".
Is this the same net as "GND-A" and "GND-B" or should the PowerPad have no connection to any pin?
Thanks in advance and best regards,
Gerald
Hi Gerald,
You can connect the power pad to the same ground plane as GND-A and GND-B. The separate grounds are provided so that you can de-couple the two channels of the amplifiers separately to help reduce crosstalk.
Regards,
Hi Jacob, thanks for your quick and precise help!
Many thanks and best regards,
Gerald