TLV8542: RUB package footprint in Datasheet are mismatch, need your support to re-confirm it.

George Liu1

Part Number: TLV8542

Hi Sir,

I got an email from customer that they realized our RUG package footprint in datasheet are mismatch.

Please refer to the pictures and share to us if there are any mistake of calculation? Or it is the misunderstanding... anything we need to know?

Thanks,

George

over 6 years ago

0 Bala Ravi over 6 years ago

TI__Expert 6625 points

Hi George,

This is due to rounding error. The values in the datasheet only has two significant figure so it is likely that 0.575mm was rounded to 0.58mm.

Best Regards,

Bala Ravi

0 George Liu1 over 6 years ago in reply to Bala Ravi

TI__Intellectual 1570 points

Hi Bala,

Thanks for your input, understood about the spec of datasheet.

But customer is asking... could we share all the specific number (Three or four decimal places) for all the RUG footprint in TLV8542 datasheet?

Thanks,

George

0 Bala Ravi over 6 years ago in reply to George Liu1

TI__Expert 6625 points

Hi George,

Please refer to Page 28 of the datasheet. It shows the dimension of the package with the range of possibilities (min to max) during packaging. The figure that your customer is referring to (Page 29) is for the board layout which already accounts for the max possible device size from page 28. Hence, I don't think 100's of nano meter resolution is required for the board layout. Please let me know if you've any questions.

Best Regards,

Bala Ravi

0 George Liu1 over 6 years ago in reply to Bala Ravi

TI__Intellectual 1570 points

Got it. Thanks Bala.

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TLV8542: RUB package footprint in Datasheet are mismatch, need your support to re-confirm it.