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LM2904: wave soldering

Toshiro Imi
Expert 7260 points
Part Number: LM2904

Hello,

Could you please tell us if LM2904 can support wave soldering, dip soldering ?

Best regards,

  • Former Member
    0 Former Member

    Hello Imi-san,

    My first reaction would be to say it is OK, if none of the temperature specifications are violated.  However, I am not very familiar with this process and would like to verify.  Please let me consult with my more senior colleagues and I will have an update for you tomorrow.

    Regards,

    Daniel

  • Former Member
    0 Former Member in reply to Former Member

    Hello Imi-san,

    I have reached out to a packaging engineer on this subject and am now waiting for his response.  I will reach out again when I have an update for you.

    Thank you for your patience.

    Regards,

    Daniel

  • 0 in reply to Former Member
    TI__Expert 7260 points

    Daniel-san,

    Thank you very much for your help. I understand your status, I am looking forward to waiting for your answer.

    Best regards,

  • Former Member
    0 Former Member in reply to Toshiro Imi

    Hello Imi-san,

    I have yet to receive a response from the individual I reached out to.

    I am trying a different channel by contacting different people.

    Thank you for your patience with this issue.

    Regards,

    Daniel

  • Former Member
    0 Former Member in reply to Former Member

    Imi-san,

    I have received a response from the packaging engineer.  Could you please confirm which package this is for?

    I assumed this was for the PDIP, but would like your confirmation.

    Thank you very much,

    Daniel

  • Former Member
    0 Former Member in reply to Former Member

    Imi-san,

    Here is the reply from the packaging engineer:

    "What package type is the question concerning?  The title states PDIP – so that would be the “P” designator. Assuming the device is mounted on the top side (way from the solder wave) there is no concern about soldering exposure.  Qualification testing is done after simulation of this exposure.   If the device is mounted on the underside of the PCB (body in direct contact with the solder wave) here is a risk of internal delamination due to moisture absorption.  This type of mounting is not recommended, and no testing is done to validate the delamination performance.   

    If this is concerning the SOIC package  “D” designator,  the LM2904D device has an MSL1-260 rating for top side PCB mounting. Backside mounting & wave soldering is not recommended for this package type. I did not find any data to support evaluation for internal delamination risk from this exposure."

    Regards,

    Daniel