Hi,
Could you tell me about soldering information of LM360.
The following application notes describe "INFRARED REFLOW SOLDERING" and "VAPOR-PHASE REFLOW SOLDERING".
http://bitsavers.trailing-edge.com/components/national/_appNotes/AN-0450.pdf
The "Vapor Phase" and "Infrared" are listed in the soldering Information for absolute maximum ratings of this device.
I understand the reflow temperature condition in each mounting method. Is it correct?
What are the specifications for the "Soldering (10 seconds)" and "Lead Temperature" of Soldering Information?
Our customers want a precise understanding of the mounting requirements for this device.
Best regards,
Yuto Sakai
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