Part Number: THS6012
Hello,
1°/ I would like to know the thermal resistances of the Power Pad Plastic SO (DWP) Package and the Microstar Junior (GQE) package.
According to you, from a thermal point of view, which package is best ?
2°/ I'm using the DWP package, and I've got thermal problems (the thermal shutdown triggers).
I use the footprint defined in the datasheet for the thermal pad with the same size and number of vias.
Could I increase the number of vias (by decreasing their diameter) ?
Could I increase the size of the pad (soldermask increase) ?
What advice to improve evacuation of heat by the power pad, could you give me ?
Thank you.
