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TLV9062: Stress Migration

Part Number: TLV9062

Dear PiC,

Would you have the data about Stress Migration of following device or share ith with us? : it is no problem that the data is the same Package.

TLV9062IDGK

We need it to pass our coustomer's resitrration

Best Regards,

Kiroku

  • Former Member
    0 Former Member

    Hello Kiroku-san,

    I am not aware of whether or not such testing or characterization is performed on our parts.  If it is performed, I am also not sure that this is information that is made publicly available.  Please let me consult with my colleagues and I will reply again here.

    In the meantime, do you have any further information about the customer's request?  The request does seem a bit vague as is.

    Regards,

    Daniel

  • Former Member
    0 Former Member

    Hello Kiroku-san,

    As a follow-up, does the customer consider stress migration to be the same as electromigration?

    Also, could you clarify the customer's application?  Is this an industrial application?

    Thanks,

    Daniel Miller

  • Hello Daniel san,

    Thank you for your confirmation.

    No, they don't consider as the same. We would like to get the information on electromigration.

    Also the application is for industrial.

    Best Regards,

  • Former Member
    0 Former Member in reply to Yusuke Kiroku

    Hello Kiroku-san,

    Unfortunately, this data was not captured for this device.

    Electromigration information is typically not captured for industrial devices, such as the TLV9062IDGK, because these devices are not expected to have as long of product life cycle times in the field.

    Here is a qualification summary from the device product page:

    Please let me know if I can be of any further assistance.

    Regards,

    Daniel

  • Dear Daniel san,

    Thank you for reply.

    Well noted, I will try to explain that  this test basically aren't implemented for industrial devices to them.

    Best Reagards,