I am planning to perform repeated thermal cycling on on PCB mounted INA317,using following steps. I am planning to pot the whole PCB in silicone to mitigate the temperature effects.
a. Warm up period.
b. 30 minutes at 138 degrees C, in ~2ATM steam atmosphere.
c. Cool down period.
Preliminary, I am planning to test output voltage using known input voltage steps. What other parameters shall I pay special attention while evaluating the performance after thermal cycling.