INA231 BGA solder pad size

Mochi

Part Number: INA231

Hello,

Our customer plan to stuff INA231 for new project.

However their Product Engineer made inquiry about solder pad size.

TI recommended pad size is d=0.23mm +/-0.02 tolerance , but if 0.20mm is acceptable it will be great help to find more PCB manufactures.

(Reference: SNVA009AI AN-1112 DSBGA Wafer Level Chip Scale Package)

Regards,

Mochizuki

over 6 years ago

0 Patrick Simmons over 6 years ago

TI__Mastermind 26335 points

Hello Mochi,

Thanks for reaching out on the forum. I am going to check with a packaging engineer and see if I can get an answer for you.

0 Patrick Simmons over 6 years ago in reply to Patrick Simmons

TI__Mastermind 26335 points

Hey Mochi,

I spoke with one of our packaging experts and this is what he said:

"If we reduced the PCB pad dimension, two things will happen:

1. The overall standoff, package thickness, will increase.

2. Due to the difference in soldering pad dimension (bump pad on
silicon and soldering pad on PCB), stress, thermal and mechanical,
will focus at the side with smaller dimension (PCB pad) and cause
failure occurred earlier than expected."

0 Mochi over 6 years ago in reply to Patrick Simmons

Genius 4325 points

Patrick,

Thank you for your prompt and valuable reply.

We will communicate with our top notch customer.

If their PE can verify reliability and dimension by themselves, then they can move forward.

Regards,

Mochizuki

Amplifiers

Amplifiers forum

INA231 BGA solder pad size