OPA548F/500

madhan raja b

HI Team,

Regarding the part, "OPA548F/500" , please provide recommended land pattern and also please mention the function of the thermal (exposed) pad in the package.Kindly reply ASAP.

over 4 years ago

0 Clemens Ladisch over 4 years ago

Guru 284840 points

Section 10.1.2 of the datasheet says:

Figure 46 provides recommended solder footprints for both the TO-220 and DDPAK power packages. The tab of both packages is electrically connected to the negative supply, V–.

0 Raymond Zhang1 over 4 years ago

TI__Guru 57241 points

Hi Madhan,

Thanks Clemens for answering the questions.

I summarized the figures and show in the image below.

If you have additional questions, please let us know.

Best,

Raymond

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OPA548F/500