TL082MJG

Hello liuyamei May,

I forwarded your question to quality engineer.  Please allow 1 to 3 day for response. 

Hello,

Is there any updates?

Thank you.

Yes, there have been three email redirects to get to the correct contact. I have sent a reminder to the person last contacted.

Do you have any information about how long you have had these devices and how they were stored (or used)?

okay，Wait for your news.Thank you.

Hello Liuyamei,

On the photo, the red arrow points to one of the leads in the corner.  However, the SEM image points shows one of the center leads.  Do you have a picture of the device with the actual issue?

Regards,

Daniel

The first response to come back is "parts are 100% Sn63Pb37 hot solder dip over non-plated Alloy-42 leadframe. Pins are dipped all the way to the package body."  Therefore there is possibility for excess solder to be on a lead. 

There may be further responses. I will report those as they come in.

liuyamei,

Kindly advise where in the process this was observed, is it at incoming or in PCB board already?

We need more photos; to see the different color on bad unit then zoom to the solder abnormal area on the pin. Use the same sample an the same pin.