OPA2189: Ball composition

Yuya Sato

Part Number: OPA2189

Our customer ask us the following question to register the device in which Sn is used, and could you kindly tell us the detail?

Material: OPA2189IDGKR

1. Use Ni for grounding or not. : Yes / No

2. Thickness of outermost layer plating :　10 μm or more / Less than 10 μm

3. Heat treatment such as annealing or not : Yes / No

Your prompt support would be highly appreciated, thank you!

over 4 years ago

0 Thomas Kuehl over 4 years ago

TI__Guru* 93105 points

Hello Sato-san,

Generally, Applications Engineering doesn't have access to all information about product assembly as our focus is the electrical application of a product. Using TI.com and a few other resources available to us I attempted to find answers to your OPA2189IDGKR materials questions.

The OPA2189IDGKR does not use any Tin (Sn), but instead the NiPdAuAg lead finish/ball material listed in the table below.

Therefore, does "register the device in which Sn is used" have any relevance when Sn is not used in the product?

I spoke with our Quality Engineer regarding the three questions you posted about the lead finish. He said that TI doesn't usually reveal detailed information about our package materials and manufacturing processes. I expect that if this is really required that an NDA would have to be in place with your company.

Regards, Thomas

Precision Amplifiers Applications Engineering

0 Yuya Sato over 4 years ago in reply to Thomas Kuehl

Intellectual 580 points

Dear　Thomas

Thank you for your comment.

Looking at following website, I can find the information on using material of lead and ball finish.

https://www.ti.com/store/ti/en/p/product/?p=OPA2189IDGKR&keyMatch=OPA2189IDGKR&tisearch=Search-EN-everything&usecase=OPN

OPA2189IDGKR have Sn, right?

In case of use Sn, I have some question that I asked you.

1. Use Ni for grounding or not. : Yes / No

　> This device use Ni for under coat ：Yes/No

2. Thickness of outermost layer plating :　10 μm or more / Less than 10 μm

3. Heat treatment such as annealing or not : Yes / No

　⇒I ask you if parts are annealed.

If you look at the website below, you will find similar questions answered.

https://e2e.ti.com/support/amplifiers/f/14/t/785924

could you please tell me

0 Thomas Kuehl over 4 years ago in reply to Yuya Sato

TI__Guru* 93105 points

Hello-Sato-san,

Yes, I see the conflict between the Lead finish/Ball material information I found on TI.com, and the OPA2198 web page information that you listed. I have sent an internal message to our Marketing Engineering team asking if they can help resolve your questions about the Lead finish/Ball materials. I'll have to wait for their responses before I can respond back to you with what they provide.

Regards, Thomas

Precision Amplifiers Applications Engineering

0 Thomas Kuehl over 4 years ago in reply to Yuya Sato

TI__Guru* 93105 points

Sato-san,

Sorry about any confusion I created regarding the OPA2189IDGKR lead and ball finish. I was looking at the OPA2189IDGKR information on the different web sites and mistakenly viewed the OPA189IDKR information. It turns out these two devices, despite using the same package, use different leadframe platings.

The OPA2189IDGKR does use a Matte Tin (Sn) leadframe plating as indicated on the TI.com web pages. I contacted our Quality Engineering department about any information they might have about the OPA2189IDGKR leadframe plating. I was told that a new composition report will be released with a target date of Monday, September 14th. Once uploaded, it will provided the information so the customer can make an informed decision about questions 1 and 2. So hopefully, we will have the information for questions 1 and 2 this coming week.

I believe that will have to inquire with the overseas OPA2189IDGKR assembler about any heat treatment/annealing that may be done by the leadframe fabricator.

Regards, Thomas

Precision Amplifiers Applications Engineering

0 Thomas Kuehl over 4 years ago in reply to Yuya Sato

TI__Guru* 93105 points

Sato-san,

Please see the link to the Material Content Search page for the OPA2189IDGKR. My understanding is this report was just posted today.

I know you have been asking about plating thickness, but I am not certain we are able to provide that information. Please let me know if this answers your ball composition questions.

Regards, Thomas

Precision Amplifiers Applications Engineering

0 Yuya Sato over 4 years ago in reply to Thomas Kuehl

Intellectual 580 points

Dear　Thomas

Thank you for your comment.

I'm sorry I couldn't see the link to the Material Content Search page for the OPA2189IDGKR.

We would appreciate it if you could answer as follows.

https://e2e.ti.com/support/amplifiers/f/14/t/785924

In case of use Sn, I have some question that I asked you.

1. Use Ni for grounding or not. : Yes / No

　> This device use Ni for under coat ：Yes/No

2. Thickness of outermost layer plating :　10 μm or more / Less than 10 μm

3. Heat treatment such as annealing or not : Yes / No

　⇒I ask you if parts are annealed.

0 Thomas Kuehl over 4 years ago in reply to Yuya Sato

TI__Guru* 93105 points

Sato-san,

The e2e broke the link when it converted the URL to the FILE image shown above. Try the link again:

www.ti.com/.../report

Hopefully, that provides some of the information you are seeking.

This is what I have been able to find out about the questions:

1. Use Ni for grounding or not. : Yes / No - No. According to the OPA2189IDGKR Material Content Report there isn't any Ni used in the lead-frame plating, or any package materials.

　> This device use Ni for under coat ：Yes/No - No

2. Thickness of outermost layer plating :　10 μm or more / Less than 10 μm - Sn thickness ranges from 7 μm to 20 μm

3. Heat treatment such as annealing or not : Yes / No - Yes.

　⇒I ask you if parts are annealed.

Thomas

Precision Amplifiers Applications Engineering

0 Yuya Sato over 4 years ago in reply to Thomas Kuehl

Intellectual 580 points

Dear　Thomas

Thank you for prompt reply!

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OPA2189: Ball composition