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TLV1701-Q1: Die differences between TLV170X-Q1 versions

Adam Daluga
Expert 6020 points
Part Number: TLV1701-Q1
Other Parts Discussed in Thread: TLV1701

Hi,

I would like to know if there are any significant differences between the dies used in the different versions of the TLV170X-Q1 components.  I see from the reliability report that all of these parts use a BICMOS process, and from the datasheet, I can see that their construction must be very similar as they all have shared performance specifications.  I would like to know if there are any major differences between the components, or if these different parts are simply different multiples of the same die copackaged for the sake of convenience?

 Thanks,
Adam

  • 0
    TI__Guru 53326 points

    Hello Adam,

    Automotive "Q1"  devices usually have a different die ID#  than the commercial device, even though the die may be the "same".

    The die ID# is usually changed because there is a slight modification done to the die to meet automotive manufacturing requirements, or, to create a separate tracking  flow  from the commercial device, or for both reasons. Usually it is for separating the automotive and commercial die fabrication flows.

    For the most part, the dies are 99.8% the same, or exactly the same (just renamed). Electrically they should be exactly the same. They are both the same process, the same layout, same process flow.

    For the TLV1701 and TLV1701-Q1, the die ID's are different, but the layout and die revisions are the same. So, yes, it is essentially the "same" die and electrically identical. The difference is in the required internal tracking "paperwork" and extra tests between the commercial and Q1 device required by AEC-Q100 specs.