Hello,
Regarding the INA188IDRJR (8-WDFN Exposed Pad) I would like to know what are the recommendations for the thermal pad connection to the PCB. On the datasheet there is no specific information about this subject besides that it should be connected to the PCB.
For single supply designs, should it be connected to the (GND) ground plane? or connected to a floating plane to be used as heatsink?
For a dual supply design, should it be connected to the (GND) ground plane or to the lowest potential (-Vs) bus?
Since I would like to get the best perfomance (lowest noise) and thermal stability (offset drift) I would appreciate any recommendations in this direction (to match the datasheet results). For a 2 layer PCB it makes more sense to use the GND (ground plane) as a heatsink for the thermal pad instead of the (-Vs) bus, so any recommendations on PCB layout are also welcome.
Thank you very much,
David
