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LM2904B: Flow mount for LM2904BIDR

akira kagiwada
Prodigy 90 points
Part Number: LM2904B


My customer uses a paper phenolic board, due to mount only on one side, they use flow solder.

We are proposing LM2904BIDR to the customer, but it is necessary to be able to mount flow solder in order to adopt it. Is the IC capable of flow soldering?

In Table 1 of the application note (SNOA040B (Mounting of Surface Mount Components)) issued by TI,

SOIC-Narrow 8pin is Since it was possible to implement the flow, is it okay to recognize that the IC can be implemented?

  • 0
    TI__Genius 15410 points

    Hello Akira,

    Most leaded surface mount devices can be soldered down using the wave soldering process. However, TI doesn’t provide any warranty to surface mount devices that are mounted by the wave soldering process because that was not the process we used to qualify the packages. TI uses the reflow soldering process to qualify our devices.

    Thank you,

    Tim Claycomb

  • 0
    Prodigy 90 points

    Hello Tim-san

    Thank you for your reply.
    Also, I am sorry for the late reply.
    I understand the answer, but the customer wants a manufacturer's warranty for mounting with flow solder.

    So we will discuss with the customer again what is necessary to adopt this product.

    Best Regards 

    Akira Kagiwada

  • 0 in reply to akira kagiwada
    TI__Genius 15410 points

    Hello,

    We will not be able to provide a manufacturer's warranty for the wave soldering process because that is not what we use to qualify our devices. Please let me know if there is anything we can do to help.

    Thank you,

    Tim Claycomb