This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

OPA547: Thermal resistance clarification

Part Number: OPA547

Hello Guys,

Good day.

I see a theta JC on the data sheet and a theta JA. I would like to know what the case resistance represents. Is it the thermal resistance from the junction to the ground slug? Do you have a value for that thermal resistance if not?

Thanks and regards,

Art

  • Hi Art,

    The really important thermal resistance in the case of the OPA547 is the junction-to-case, θJC. It represents the internal thermal path resistance from the die, through the TO-220 slug. The vast majority of the heat will be conducted out of the die and package through this path.

    The Thermal Resistance θJC, is specified with a "typical" of 2 °C/W for f > 50 Hz, and 3 °C/W for dc. Use the applicable condition number for the heat sink determination.

    Regards, Thomas

    Precision Amplifiers Applications Engineer