Hi everyone, I hope that you helps me.
I have a board with TPA3112D1 and in some board after 3-4 mins the TPA go to fault condition.
If we measure temperature above the case, we measure 43,4°C and we are in a Tambient = 25°C.
We have checked all signal, all component but there isn't difference between our board and reference schematic.
This product is in mass production by many years, the last 100 pieces that we have products have this problem.
Under the chip there's a thermal PAD.
I read in one FAQ that we must pay attention to bootstrap capacitor ( 470nF 16V ) between BSP and BSN and OUTP/OUTN, these capacitor are mounted and it is 470nF 25V.
DO YOU HELP ME?
I have a board with TPA3112D1 and in some board after 3-4 mins the TPA go to fault condition.
If we measure temperature above the case, we measure 43,4°C and we are in a Tambient = 25°C.
We have checked all signal, all component but there isn't difference between our board and reference schematic.
This product is in mass production by many years, the last 100 pieces that we have products have this problem.
Under the chip there's a thermal PAD.
I read in one FAQ that we must pay attention to bootstrap capacitor ( 470nF 16V ) between BSP and BSN and OUTP/OUTN, these capacitor are mounted and it is 470nF 25V.
DO YOU HELP ME?
Thank you
Davide
