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Amplifier class-d TAS5611

Hans Nilsson
Prodigy 70 points
Other Parts Discussed in Thread: TAS5611, TAS5611A

Hi.

I have problem with different power consumption on TAS5611 (TAS5611A). Power consumption change up to 1W with different IC on the same design.

 

Ir-camera show a great difference temperature on TAS5611 chip.

 

Can somebody explain why?

  • 0
    TI__Mastermind 18510 points

    Hans, we will need to know about your design to try to answer.  Can you send the schematic and PCB layout in PDF, with data sheets for the LC filter components and decoupling caps?

    Regards,

    Steve.

  • 0 in reply to SteveCrump
    TI__Mastermind 18510 points

    Hans, please also tell us about the power dissipations and the temperatures that you measure and the thermal compound you are using, and show us the design your heatsink.

    Regards,

    Steve.

  • 0 in reply to SteveCrump
    Prodigy 70 points

    Hi. I compare IC in same design on same printer circle board. In standby mode (no Reset) without load speaker give 1W difference on power in. In this test IC is no heatsink mounted.

    In picture can you se difference between IC (time after ca 1min). IC lost most power , has dot right down in IC.

     

    Voltage in is 27V(PVDD_x) and 12V(GVDD_x, VDD). Filter design is from TAS5611A data blade figure 12.

     

  • 0 in reply to Hans Nilsson
    TI__Mastermind 18510 points

    Hans, if the thermal images you posted were taken in ambient temperature around 22 to 25 C, they explain the situation.  If ambient was 25C, the temperatures in them represent temperature rises of 4.8 and 3.8 C.  The larger rise is about 26% higher than the lower rise, but this is not surprising.  Quiescent power dissipation depends on PVDD, GVDD and VDD currents listed on page 10 of data sheet SLAS709A.  These are typicals that can vary +/-50%, so it is not surprising that you have seen temperature rise (and therefore power dissipation) vary by 26%.

    This is not a problem, because TAS5611A is always operated with a heatsink to keep its temperature rise within working limits when it dissipates power under load.  With a heatsink the temperature rise contributed by quiescent power dissipation is essentially negligible.

    Regards,

    Steve.

  • 0 in reply to SteveCrump
    Prodigy 70 points

    Hello Steve.

    Thank for you answer. I am not sure were in specification tells quiescent current change with temperature?

     

    My idea was power consumption change for that reason rise/fall time on OUT_x is different between IC chips. I cannot se this time different on oscilloscope.

    Regards

    Hans