TLV320AIC3104: TLV320AIC3104

Lev Gelerman

Prodigy 20 points

Part Number: TLV320AIC3104

Hi,

We are connected the HPR_COM/HPL_COM to GND (see schematics below).

When the headfones are connected we facing with overheating of device.

Can you please advise what is a wrong.

5 months ago

0 Daveon Douglas 5 months ago

TI__Genius 13740 points

Hi Lev,

I don't see anything necessarily wrong with your schematic, what are you plugging into J2 and J5? A standard headphone shouldn't cause this issue, so what is the input signal and rating into MIC2. What is the impedance of the microphone?

Additionally, if your headphone has a MIC or is a T/R/R/S type, you can connect MIC2 directly into pin 4 of the audio jack to eliminate J5 all together.

Regards,

0 Lev Gelerman 5 months ago in reply to Daveon Douglas

Prodigy 20 points

Hi,

Can you provide what is recommended connection of TI for HPR_COM/HPL_COM if it''s unused.

Thanks,

0 Daveon Douglas 5 months ago in reply to Lev Gelerman

TI__Genius 13740 points

Hi Lev,

The connection seems fine as is, the customer is setting the common mode of the headphone driver to GND just as the sleeve (pin 1) of the the audio jack is connected to GND.

Additionally, this application note covers different headphone output configurations. Headset Detection for TLV320AIC33 and TLV320AIC310x Family

Regards,

0 Lev Gelerman 5 months ago

Prodigy 20 points

Hi,

We varified the over heating issue acquiring when we connected the standard speacker to HP port (J2), in this case codec reached 93C deg (see attached picture) in short time, when jack was out the temperature was about 34C deg

0 Daveon Douglas 5 months ago in reply to Lev Gelerman

TI__Genius 13740 points

Hi,

What is the speaker load? Also, what current do you measure driving the speaker?

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TLV320AIC3104: TLV320AIC3104