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TPA6120A2 Differences Between HSOP package and VQFN package

Sadanori Kato
Guru 36540 points
Other Parts Discussed in Thread: TPA6120A2

Hi,

Could you please tell us the differences between the HSOP package and the VQFN package as below ?

Q1. Operating Characteristics
Is the operating characteristics of each package exactly the same ?

Q2. Thermal Characteristics
Which one is superior for the thermal characteristics ?

Q3. Handling NC Pin
Are both devices possible to connect the NC pin to ground ?

Best regards,
Kato

  • 0
    TI__Guru 57800 points

    Hi Kato-San, 

    The operating characteristics of both devices should be the same.

    The thermal characteristics of each package are shown in section 7.4 of the TPA6120A2 Datasheet.

    Both devices NC pins are not connected internally so they can be connected to ground without any problems.

    Best Regards,

      -Diego Meléndez López
       Audio Applications Engineer

  • 0 in reply to Diego Melendez
    Guru 36540 points

    Hi Diego-san,

    Thank you for your quick response.
    Could you please give me your advice again regarding the following questions ?

    Q1. Operating Characteristics
    I understood.

    Q2. Thermal Characteristics
    The thermal information is mentioned on page 4 of the data sheet as below.
    It seems that the VQFN package is superior than the HSOP package for the heat dissipation performance to the pcb although the size of HSOP's PowerPAD is larger than the size of VQFN's PowerPAD.
    Which one is correct for the heat dissipation performance to the pcb ?

    Q3. Handling NC Pin
    I checked the evms of the HSOP/VQFN package, the NC pins are connected to ground on the evm which the HSOP package is mounted.
    On the other hand, the NC pins are floating on the evm which the VQFN package is mounted.
    Is the NC pins of the VQFN package also possible to be connected to ground ?
    Could you please confirm it again ?

    Best regards,
    Kato