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TAS5414B-Q1: Thermal Foldback

Part Number: TAS5414B-Q1
Other Parts Discussed in Thread: TAS5414

Dear Team,

do you have a graph that describes the derating of gain with temperature when any output channel is in thermal foldback?

Or any explanation what gain we shall expect at higher temperature would do.

Does the thermal foldback start after the OTW level 1 and decreases the gain with increasing temperature?

Does the TAS5414 use the same temperature sensor for OTW and thermal foldback or are there different measuring locations for one channel?

Please let me know if you need more information.

Thanks and best regards,

B

  • In the specification section of the datasheet you will find that the thermal foldback temperature specification.  Typical is 150C.  The OTW and the Thermal Foldback circuitry are not connected and use different temperature sensors.  The thermal foldback uses a temperature sensor that is located near the output FETs on each channel.  This sensor will heat rapidly if there is rapid heating of the FET under unusually high current ramping on the FETs.  This sensor heats faster than the global thermal sensor that is used by the OTW and the global over temperature shut down.  

    The thermal foldback is considered a protection feature and should not be used as a limiter in normal operations.  The gain reduction is very quick to reduce to -20dB, typically in a 15C window.  This is not specified in the datasheet and the values of gain reduction and temperature window are not guaranteed.