Hi,
I would like you to confirm about below.
* Could you please provide thermal information ?
At least, I need below.
- Rθjc(top) (Junction to case(top))
And it is helpful to provide below as well.
- RθJA Junction-to-ambient thermal resistance
- RθJB Junction-to-board thermal resistance
- ψJT Junction-to-top characterization parameter
- ψJB Junction-to-board characterization parameter
- RθJC(bot) Junction-to-case (bottom) thermal resistance
Best Regards,
