I am using the Device as per the data sheet. However we are getting the device over heating and failing. I do have a "heatsink via the base of the device soldered onto the pcb tracking, but not to anything else.It looks like thermal runaway. Can this happen?
If the soldering of the bottom of the ic is not soldered to Ground, can it fail? Is a 0.1uF on the Bi-pass pin 2 ok?