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CDCE62002 Core Tempaerature

shadders
Expert 1065 points
Other Parts Discussed in Thread: CDCE62002

Hi,

I have implemented the CDCE62002 on a PCB and used the requisite ground pad underneath the IC.

Can you provide the core temperature of this IC if providing 30MHz clocks on the outputs ?.

What should the measured surface temperature be on top of the IC ?.

Would like to ensure that the termal pad on the bottom is adequate.

Thanks and regards,

Richard.

  • 0
    TI__Expert 4585 points

     

    Hi Richard,

    The core temperature depends on power dissipation of the device. Please use Table 22 in the datasheet to estimate the power dissipation.

    Using Theta_JA  (The number is in the datasheet - based on JEDEC standard board) and your ambient temperature, you can estimate the core temperature.

    TJ = TA + Pd *Theta_JA

    The maximum allowable junction temperature is 125C.

    Using the Psi_JT (0.3C/W) and power dissipation, you can calculate the surface temperature of the top. You can see Psi_JT number is pretty low, as most of the heat will dissipate through ground pad.

    Thanks,

    Firoj

     

     

  • 0 in reply to Firoj Kabir
    Expert 1065 points

    Hi Firoj,

    Thanks. Was not sur - i have attached the IC using the side pins solder - i will have to add solder paste to the holes underneath - PCB - and use a hot air gun to solder accordingly.

    I have some small plastic heatsinks which i can attach to the top of the IC also - i will be using both outputs - CMOS mode.

    I put my finger on the IC top - was reasonably warm - i am certain the bottom of the IC is on the square ground PAD underneath - just not soldered yet.

    Thanks for the reply - apologies that mine is late.

    Regards,

    Richard.