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LMK04826: How many vias are required in case of 0.3phi instead of 0.2phi?

Kazuhiko Hirano
Genius 11613 points
Part Number: LMK04826

Hello,

My customer would like to use. LMK04826.
However, their PCB design rule does not allow 0.2phi via, they have to use 0.3phi via.
Though the datasheet suggests 32x 0.2phi vias as a land pattern example, how many 0.3phi vias does TI recommend to keep the same thermal performances?

Best regards,

K.Hirano

  • 0
    TI__Genius 12550 points

    Hi Hirano,

    I'll need to get the details from internal team and will respond you soon.

    Regards,

    Ajeet Pal

  • 0 in reply to Ajeet Pal
    TI__Genius 11613 points

    Ajeet,

    How is it going?
    My customer is awaiting TI response.

    Best regards,

    K.Hirano

  • 0 in reply to Kazuhiko Hirano
    TI__Genius 12550 points

    Hi Hirano,

    TI recommended thermal vias with result to thermal performance stated in datasheet per PCB board design like EVM board design.

    TI don't simulate the customer specific systems/requirement. Via pattern has an impact, but other factors such as PCB design and stack-up, other components, system, etc., will also influence the junction temperature.

    As they increase the via size (with the same quantity), the overall thermal pad density will reduce, but if could provide the immediate ground plane and other ground planes based on stack up, which could provide the good heat flow to other ground layer. These are the generic understanding, but would be better, if customer can have a look based on their exact stack up details.

    Thanks!

    Regards,
    Ajeet Pal