We are having issues reflowing the LMX2531LQ1500E. Following recommended guidelines has yielded no better results than before. Like previous post regarding this issue (https://e2e.ti.com/support/clock-and-timing/f/48/t/649000), we can manually place the component using a hot-air tool with better results than with the reflow of the entire board.
We have a 0.004" thick stencil with trapezoidal cutouts. We are using Chipquick Solder Paste: SMD291SNL50T3
One of our theories is we have too much paste on the ground pad.
Can you make any further recommendations for improving our yield on this part?
STENCIL CUTOUT - PER /cfs-file/__key/communityserver-discussions-components-files/48/LMX2531-footprint.pdf
STENCIL THICKNESS: 0.004"
Trapezoidal Apertures