We’re doing a DPA on a 5962R1723601VXC (LMX2615WRQMLV). Per MIL-STD-883, TM 2018, SEM is not required for planar die. Is the die fully planar with no oxide steps? Are chemical mechanical polish (CMP) processes used? Or is SEM required?
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We’re doing a DPA on a 5962R1723601VXC (LMX2615WRQMLV). Per MIL-STD-883, TM 2018, SEM is not required for planar die. Is the die fully planar with no oxide steps? Are chemical mechanical polish (CMP) processes used? Or is SEM required?
Hello Michael,
The process for the 5962R1723601VXC (LMX2615WRQMLV) is fully planarized.