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LMX2615-SP: About DAP

Noriyuki Takahashi
Genius 11270 points
Part Number: LMX2615-SP


Hi team,

1. Is the purpose of DAP for heat dissipation?

2. Should DAP be connected to GND electrically?

3. Is it OK that they don't need to solder DAP on the GND of the board and they just put DAP closely on the board for heat dissipation?

Regards,

Noriyuki Takahashi 

  • +1
    TI__Guru** 111060 points

    Hi Takahashi-san,

    DAP should be connected to GND. GND layer is usually the second layer below the device. Sufficient number of thermal via should be placed between the DAP pad (on the first layer) and the GND layer in order to let the heat flow to the GND layer. The DAP pad alone is not sufficient to dissipate heat.