CDCE6214: Questions about the Package Dimensions

Darren (FAE)

Part Number: CDCE6214

The RGE package used by the CDCE6214 appears to have these "corners" on the bottom (A1 ~ A4)

[1]
These anchor pins do not require an electrical connection, but may be connected to GND for better board-level reliability, right?

[2]
I can see the A1~A4 pins are 0.25mm away from the edge of the nearest pin in the x-direction.
But is this also 0.25mm from the edge of the nearest pin in the y-direction?

Regards,
Darren

over 3 years ago

0 vicente flores prado over 3 years ago

TI__Mastermind 32152 points

Hi Darren,

That is correct, can be left floating or soldered to PCB GND plane for better board-level reliability.

Yes, still .25mm

Regards,

Vicente

0 Darren (FAE) over 3 years ago in reply to vicente flores prado

TI__Expert 5483 points

Hi Vicente,

Quick follow-up.

If A1~A4 are used, is there a requirement on solder coverage?

https://www.ti.com/lit/an/sloa122/sloa122.pdf
This document section 2.1.3 discusses QFN layout guidelines, and >50% coverage is recommended for the thermal pad to help limit voiding.
Is there a similar requirement for the A1~A4 pins?

Regards,
Darren

0 vicente flores prado over 3 years ago in reply to Darren (FAE)

TI__Mastermind 32152 points

Hi Darren,
Should still be >50%.

Regards,

Vicente

0 Darren (FAE) over 3 years ago in reply to vicente flores prado

TI__Expert 5483 points

Hi Vicente,

Another follow-up to this. Can you confirm the 3~4 questions in the attached material please?

PDF w/ Questions

0 vicente flores prado over 3 years ago in reply to Darren (FAE)

TI__Mastermind 32152 points

Hi Darren,
I will follow up on this tomorrow.

Regards,

Vicente

0 vicente flores prado over 3 years ago in reply to vicente flores prado

TI__Mastermind 32152 points

Hi Darren,
We have reached out to packaging, still waiting on a response. I will update you as soon as I hear back from them.

Regards,

Vicente

+1 vicente flores prado over 3 years ago in reply to vicente flores prado

TI__Mastermind 32152 points

Hi Darren,
Here is the answer we received from packaging.

Regards,

Vicente

0 Darren (FAE) over 3 years ago in reply to vicente flores prado

TI__Expert 5483 points

Hi Vincente,

1) Just some clarification on the 0.05/0.00 number.
This is the difference between the bottom surface of the metal pins and the molding/package, right?
*See image (A)

2) Max warpage is defined as 0.08mm; this is the difference between what exactly?
i.e. the difference between the bottom of two pins?
*See image (B)