LMK5C33216: maximum force to be applied on tpackage

ilan benoliel

Part Number: LMK5C33216

Hello,

Please advise the maximum force to be applied on LMK5C33216 package, since it appears from the thermal simulations that adding a TIM material will help to dissipate the heat of this IC

Thank you,

Ilan

over 1 year ago

0 Asim Khan over 1 year ago

TI__Genius 9250 points

Hi Ilan,

I have forwarded your question to our expert. They will get back to you in a day or two.

Best,

Asim

0 Jennifer Bernal over 1 year ago in reply to Asim Khan

TI__Genius 10955 points

Ilan,

Let me check with the package team on this request.

Meanwhile, can you please clarify why you need to know the max force?

Regards,

Jennifer

0 ilan benoliel over 1 year ago

Prodigy 40 points

Thank you.

we need the max force since we want to place a thermal pad on top of the package to cool it down, from the simulation results, it appears it will be helpful to cool the component from the top of the package also.

0 Jennifer Bernal over 1 year ago in reply to ilan benoliel

TI__Genius 10955 points

Hi Ilan,

I checked with the packaging team. We do not have the force data tested to provide you an answer.

Regards,

Jennifer

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LMK5C33216: maximum force to be applied on tpackage